Advanced PCB Manufacturing: Diverse Materials and Precision Processes
PCB Manufacturing Introduction:
Elevate your electronics with our PCB factory's versatile offerings. We excel in producing 1 to 12-layer boards using top-tier insulation materials like FR4, aluminum, copper, ceramic, PI, and PET. Our range includes glueless rolled copper, glued rolled copper, and glued electrolytic copper for superior conductivity.
With a finished plate thickness of 0.07mm and above (tolerance +5%/-6%), our PCBs are designed for precision. The inner layer copper thickness spans from 18-70μm, while the outer layer boasts 20-140μm, ensuring optimal performance.
Choose from a spectrum of solder-resist colors and letters like red, green, yellow, blue, white, black, and silver, allowing you to tailor designs to perfection. Our offerings include anti-oxidation, HASL, immersion gold, gold-plated, and silver-plated treatments, as well as specialized processes like thick copper plating, impedance control, and high-frequency plates.
Reinforce designs with materials like FR4, steel sheet, and electromagnetic shielding film, and experience the freedom of a maximum size of 50mm x 100mm. Our precision is unmatched with outer/inner line width and spacing at 0.065mm/3mil, and minimum requirements for solder resist ring width, solder bridge width, solder mask window, and aperture.
Maintaining impedance tolerance at 10%, our products adhere to shape tolerances of +0.05mm G laser +0.005mm. Opt for forming methods like V-cut, CNC, or punching to meet your fabrication needs. Embrace innovation with our dynamic and precise PCB solutions.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over 95%
4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process
Product Tags:
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ISO/UL PCB Board Manufacturing For Industrial Control / Medical / Consumer Electronics Images
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